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SFS-EN 62047-17:en

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

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Scope
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

The standards writing body responsible for this document in Finland is Electrotechnical Standardization in Finland.
Product group(s)
31.080.99 Other semiconductor devices »
Relationships
Normative references
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Technical committee
CLC/SR 47F Micro-electromechanical systems »
Date of implementation
14.09.2015
Published
01.03.2016
Edition
1
Pages
37
Language(s)
English

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