IEC TS 62861:2017(E) This Technical Specification provides guidelines for establishing confidence in product reliability using principal component testing for LED light sources and LED luminaires for general lighting. It includes methods and criteria using initial qualification tests and accelerated stress tests of the principal components. The performance of any principal component will influence the performance of the final product. Techniques to validate full lifetime claims and lumen maintenance projection are outside the scope of this Technical Specification. The following principal components are included in the testing if they are used as an integral part for the LED light source or LED luminaire: - LED package and interconnects; - optical materials; - electronic subassemblies; - cooling systems, both active (e.g. fans) and passive (e.g. thermal interface material); - construction materials. This Technical Specification is not recommended for use as a normative reference to the LED product performance standards.
ANSI/ESDA/JEDEC JS-001-2014 Electrostatic discharge sensitivity testing human body model (HBM) – Component level
ASTM D5470 – 12 Standard test method for thermal transmission properties of thermally conductive electrical insulation materials
ASTM D7027 – 13 Standard test method for evaluation of scratch resistance of polymeric coatings and plastics using an instrumented scratch machine
ANSI/ESDA/JEDEC JS-001-2014 Electrostatic discharge sensitivity testing human body model (HBM) – Component level
ASTM D5470 – 12 Standard test method for thermal transmission properties of thermally conductive electrical insulation materials
ASTM D7027 – 13 Standard test method for evaluation of scratch resistance of polymeric coatings and plastics using an instrumented scratch machine
ASTM E595 – 07 Standard test method for total mass loss and collected volatile condensable materials from outgassing in a vacuum environment
IEC 60068-2-20:2008 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-27:2008 Basic environmental testing procedures – Part 2: Tests – Test Ea and guidance: Shock
IEC 60068-2-30:2005 Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic (12 h + 12 h cycle)
IEC 60068-2-42:2003 Environmental testing – Part 2-42: Tests – Test Kc: Sulphur dioxide test for contacts and connections
IEC 60068-2-43:2003 Environmental testing – Part 2-43: Tests – Test Kd: Hydrogen sulphide test for contacts and connections
IEC 60068-2-58:2015 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-60:2015 Environmental testing – Part 2-60: Tests – Test Ke: Flowing mixed gas corrosion test
IEC 60529:2013 Degrees of protection provided by enclosures (IP Code)
IEC 60929:2011 AC and/or DC-supplied electronic control gear for tubular fluorescent lamps – Performance requirements
IEC 60929:2011/AMD1:2015
IEC 62504 General lighting – Light emitting diode (LED) products and related equipment – Terms and definitions
IPC-9591 Performance parameters (mechanical, electrical, environmental and quality/reliability) for air moving devices
J-STD-002D Solderability tests for component leads, terminations, lugs, terminals and wires
J-STD-020E Moisture/reflow sensitivity classification for nonhermetic surface mount devices
JESD22-A101C Steady-state temperature humidity bias life test
JESD22-A104D Temperature cycling
JESD22-A108D Temperature, bias, and operating life
JESD22-A113F Preconditioning of plastic surface mount devices prior to reliability testing
JESD22-B103B Vibration, variable frequency
JESD51-51 Implementation of the electrical test method (static test method) for the measurement of the real thermal resistance and impedance of light emitting diodes with exposed cooling surface
MIL-C-48497A Durability requirements for coating, single or multilayer, interference