Verkkokauppa
SFS-EN 61191-3:2017:en
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Soveltamisala
Suomenkielistä soveltamisalaa ei ole saatavissa.
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
Tuoteryhmä(t)
Sidokset
Velvoittavat viittaukset
EN 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IPC-A-610
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IPC-A-610
Tekninen komitea
Vahvistuspäivä
15.09.2017
Julkaisupäivä
19.09.2017
Painos
2
Sivumäärä
25
Julkaisun kieli
englanti