SFS-EN IEC 61760-1:2020:en

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IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.

The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.

Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.

This edition includes the following significant technical changes with respect to the previous edition:

a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.

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Velvoittavat viittaukset

EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60068-2-45:1992 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents

EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60068-2-45:1992 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 61340-5-1:2016 Staattinen sähkö. Osa 5-1: Elektronisten komponenttien suojaaminen staattiselta sähköltä. Yleiset vaatimukset
EN 61340-5-3:2015 Staattinen sähkö. Osa 5-3: Elektronisten komponenttien suojaaminen staattiselta sähköltä. Sähköstaattisille purkauksille herkille komponenteille tarkoitettujen pakkausten ominaisuuksien ja vaatimusten luokittelu
EN 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
EN 62090:2017 Product package labels for electronic components using bar code and two- dimensional symbologies
EN IEC 60068-2-21:2021 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN IEC 60286-3:2019 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN IEC 60286-3:2022 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN IEC 60286-5:2018 Packaging of components for automatic handling - Part 5: Matrix trays
EN IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
EN IEC 61340-5-3:2022 Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
EN IEC 61760-2:2021 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
FprEN IEC 60068-2-21:2021 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068:201X
IEC 60194-2:2017
IPC/JEDEC J-STD-020E
IPC/JEDEC J-STD-033B:2007
prEN IEC 60068-2-21:2019 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
prEN IEC 61760-2:2020 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Tekninen komitea

CLC/SR 91 Electronics assembly technology »

Vahvistuspäivä

09.10.2020

Julkaisupäivä

13.10.2020

Painos

1

Sivumäärä

48

Julkaisun kieli

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