Verkkokauppa
SFS-EN 62562:en
Cavity resonator method to measure the complex permittivity of low-loss dielectric plates
Soveltamisala
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IEC 62562:2010(E) describes a measurement method of dielectric properties in the planar direction of dielectric plate at microwave frequency. It has been created in order to develop new materials and to design microwave active and passive devices for which standardization of measurement methods of material properties is more and more important. It has the following characteristics: - the relative permittivity ε′ and loss tangent tanδ values of a dielectric plate sample can be measured accurately and non-destructively; - temperature dependence of complex permittivity can be measured; the measurement accuracy is within 0,3 % for ε′ and within 5 x 10-6 for tanδ; - fringing effect is corrected using correction charts calculated on the basis of rigorous analysis. It is applicable for the measurements on the following condition: - frequency: 2 GHz -6 -2. This first edition cancels and replaces the PAS published in 2008.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
IEC 62562:2010(E) describes a measurement method of dielectric properties in the planar direction of dielectric plate at microwave frequency. It has been created in order to develop new materials and to design microwave active and passive devices for which standardization of measurement methods of material properties is more and more important. It has the following characteristics: - the relative permittivity ε′ and loss tangent tanδ values of a dielectric plate sample can be measured accurately and non-destructively; - temperature dependence of complex permittivity can be measured; the measurement accuracy is within 0,3 % for ε′ and within 5 x 10-6 for tanδ; - fringing effect is corrected using correction charts calculated on the basis of rigorous analysis. It is applicable for the measurements on the following condition: - frequency: 2 GHz -6 -2. This first edition cancels and replaces the PAS published in 2008.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
Sidokset
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Tekninen komitea
Vahvistuspäivä
20.06.2011
Julkaisupäivä
01.03.2016
Painos
1
Sivumäärä
27
Julkaisun kieli
englanti