Verkkokauppa
SFS-EN 62258-6:en
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Soveltamisala
Suomenkielistä soveltamisalaa ei ole saatavissa.
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
Sidokset
Velvoittavat viittaukset
EN 62258-1:2005 Semiconductor die products - Part 1: Requirements for procurement and use
EN 62258-2:2005 Semiconductor die products - Part 2: Exchange data formats
EN 62258-2:2005 Semiconductor die products - Part 2: Exchange data formats
Tekninen komitea
Vahvistuspäivä
25.03.2008
Julkaisupäivä
01.03.2016
Painos
1
Sivumäärä
16
Julkaisun kieli
englanti