SFS-EN 62258-1:en

Soveltamisala

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IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).

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Sidokset

Velvoittavat viittaukset

CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
CLC/TR 62258-4:2007 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange

CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
CLC/TR 62258-4:2007 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-4:2014/A1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 61360-1:2010 Standard data elements types with associated classification scheme for electric items - Part 1: Definitions - Principles and methods
EN 62258-2:2005 Semiconductor die products - Part 2: Exchange data formats
EN 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
EN 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
EN ISO 14644-1:2015 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015)
IEC 60050:201X

Tekninen komitea

CLC/SR 47 Semiconductor devices »

Vahvistuspäivä

20.06.2011

Julkaisupäivä

01.03.2016

Painos

1

Sivumäärä

52

Julkaisun kieli

englanti