This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
CLC/TR 62258-4:2007 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
EN 62258-1:2005 Semiconductor die products - Part 1: Requirements for procurement and use
EN 62258-2:2005 Semiconductor die products - Part 2: Exchange data formats
CLC/TR 62258-4:2007 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
EN 62258-1:2005 Semiconductor die products - Part 1: Requirements for procurement and use
EN 62258-2:2005 Semiconductor die products - Part 2: Exchange data formats
EN 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
EN 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
IEC 60050-131:2002 International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory