Verkkokauppa
CLC/TR 62258-4:en
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
Soveltamisala
Suomenkielistä soveltamisalaa ei ole saatavissa.
IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein.
This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein.
This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.
Tämän julkaisun valmistelusta Suomessa vastaa SESKO ry, puh. 050 571 6048.
Tuoteryhmä(t)
Sidokset
Velvoittavat viittaukset
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC 60050-617:2009 International Electrotechnical Vocabulary (IEV) - Part 617: Organization/Market of electricity
EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC 60050-617:2009 International Electrotechnical Vocabulary (IEV) - Part 617: Organization/Market of electricity
Tekninen komitea
Vahvistuspäivä
14.09.2015
Julkaisupäivä
01.03.2016
Painos
1
Sivumäärä
25
Julkaisun kieli
englanti